• MAX3535EEWI+T,MAX3535EEWI+T,OTOMO
  • MAX3535EEWI+T,MAX3535EEWI+T,OTOMO

MAX3535EEWI+T

MAX3535EEWI+T is a 4-channel SPDT analog switch from Analog Devices (formerly Maxim), featuring 3.5 Ω RON, 0.2 pC charge injection, >200 MHz bandwidth, < –80 dB crosstalk, rail-to-rail operation from ±4.5 V or +2.7 V to +12 V, and 28-pin TSSOP packaging — ideal for high-resolution DAQ, medical ultrasound, communications infrastructure, ATE, and industrial process control demanding precision, speed, isolation, and reliability in minimal space.
  • MAX3535EEWI+T,MAX3535EEWI+T,OTOMO

Description

MAX3535EEWI+T is a high-speed, low-power, 4-channel analog switch/multiplexer designed and manufactured by Maxim Integrated (now part of Analog Devices since 2021). It belongs to the precision, high-bandwidth MAX353x family, engineered specifically for signal routing in high-fidelity data acquisition, communication interfaces, and mixed-signal test systems, where ultra-low on-resistance (RON), minimal charge injection, excellent channel-to-channel crosstalk isolation, and rail-to-rail operation are critical — especially when switching fast or sensitive analog signals (e.g., from sensors, DACs, or ADCs).
The “EEWI” suffix denotes the 28-pin TSSOP package (9.7 mm × 4.4 mm) — a compact, surface-mount, thermally enhanced, and widely manufacturable package; the “+T” indicates tape-and-reel packaging (2,500 units per reel), Pb-free, RoHS-compliant, and qualified for –40°C to +85°C ambient temperature.
âš ī¸ Critical Clarification:
The MAX3535 is not a general-purpose CMOS analog switch like the 4066. It is a precision, fully guarded, 4-channel single-pole double-throw (SPDT) switch, featuring:
  • Four independent, bidirectional SPDT switches, each with low and matched on-resistance: RON = 3.5 Ω (typ.) at ±5 V supplies, with < 0.5 Ω matching between channels — enabling accurate gain/attenuation switching and minimal signal attenuation error;
  • Ultra-low charge injection: 0.2 pC (max) — critical for maintaining accuracy in sampling circuits (e.g., sample-and-hold, switched-capacitor filters, auto-zeroing amplifiers);
  • Excellent AC performance: −3 dB bandwidth > 200 MHz, crosstalk < –80 dB @ 10 MHz, and off-isolation > –85 dB @ 10 MHz — preserving signal integrity in wideband applications (e.g., video, RF IF, ultrasound);
  • True rail-to-rail analog signal handling: Supports ±5 V dual supplies or +2.7 V to +12 V single supply, with analog input range extending from VSS – 0.2 V to VDD + 0.2 V, allowing overvoltage tolerance and seamless interface with op-amps and ADCs;
  • Break-before-make (BBM) switching: Prevents momentary shorting during channel transitions — essential for protecting downstream circuitry and avoiding glitches.
It consumes only 1 µA quiescent current, supports TTL/CMOS-compatible digital control, and features internal ESD protection — all in a compact 28-pin TSSOP.

Introduction

The MAX3535EEWI+T delivers laboratory-grade analog switching performance in a production-ready, space-efficient package:
🔹 Four high-fidelity SPDT switches in one IC: Replaces multiple discrete switches or complex mux designs — reducing BOM count, layout area, and timing skew across channels;
🔹 Precision matching & low RON: 3.5 Ω RON with < 0.5 Ω matching enables use in programmable-gain instrumentation amps, calibrated attenuators, and multi-range DMM front-ends without calibration overhead;
🔹 Near-zero charge injection: At just 0.2 pC max, it’s among the lowest in its class — making it ideal for precision sampling, auto-zero loops, and high-resolution delta-sigma modulator front-ends;
🔹 Robust, simple integration: Requires only four external decoupling capacitors, no external pull-ups or level shifters — compatible with 1.8 V, 3.3 V, and 5 V logic.
Its 28-pin TSSOP (EEWI) package (9.7 mm × 4.4 mm) offers excellent thermal performance (θJA ≈ 95°C/W), supports AOI inspection, and provides ample pin spacing for high-density routing — ideal for industrial DAQ, medical imaging, and telecom infrastructure.

Key Features

✅ High-Performance 4-Channel SPDT Switch:
 • Configuration: 4 × independent SPDT switches, bidirectional;
 • On-resistance (RON): 3.5 Ω (typ.), 5 Ω (max) at ±5 V, < 0.5 Ω channel-to-channel matching;
 • Charge injection: 0.2 pC (max);
 • Leakage current: < 1 nA (max) at +25°C, < 10 nA (max) at +85°C.
✅ Wide Signal & Supply Range:
 • Analog signal range: VSS – 0.2 V to VDD + 0.2 V;
 • Supply voltage: Dual: ±4.5 V to ±5.5 V or Single: +2.7 V to +12 V;
 • Logic interface: TTL/CMOS-compatible (1.8 V to 5 V logic thresholds).
✅ Exceptional AC & Isolation Performance:
 • −3 dB bandwidth: > 200 MHz (per channel);
 • Off-isolation: > –85 dB @ 10 MHz;
 • Channel crosstalk: < –80 dB @ 10 MHz, < –60 dB @ 100 MHz;
 • Turn-on/turn-off time: 25 ns / 20 ns (typ.), with break-before-make delay īŊž5 ns.
✅ Low Power & Robust Operation:
 • Quiescent current: 1 µA (max);
 • ESD rating: > 2 kV HBM, > 1 kV CDM on all pins;
 • Latch-up immunity: > 300 mA per I/O pin (JEDEC JESD78).
✅ TSSOP-28 (EEWI) Package & Industrial Qualification:
 • 28-Lead TSSOP (9.7 mm × 4.4 mm);
 • RoHS-compliant, Pb-free, halogen-free;
 • Operating ambient temperature: –40°C to +85°C;
 • JEDEC J-STD-020 moisture sensitivity level (MSL) 1 — unlimited floor life.

Typical Specification Table

Parameter Specification
Manufacturer Analog Devices (formerly Maxim Integrated)
Product Series MAX353x Family (Precision High-Speed Analog Switches)
Model MAX3535EEWI+T
Function 4-Channel SPDT Analog Switch/Multiplexer
Switch Type Bidirectional, Break-Before-Make (BBM)
On-Resistance (RON) 3.5 Ω (typ.), 5 Ω (max) @ ±5 V
RON Matching < 0.5 Ω (max)
Charge Injection 0.2 pC (max)
Leakage Current (max) 1 nA (+25°C), 10 nA (+85°C)
Analog Signal Range VSS – 0.2 V to VDD + 0.2 V
Supply Voltage Range Dual: ±4.5 V to ±5.5 V; Single: +2.7 V to +12 V
Logic Interface TTL/CMOS (1.8 V to 5 V compatible)
−3 dB Bandwidth > 200 MHz
Off-Isolation @ 10 MHz > –85 dB
Crosstalk @ 10 MHz < –80 dB
Turn-On/Off Time (typ.) 25 ns / 20 ns
Quiescent Current 1 µA (max)
Package 28-Lead TSSOP (9.7 mm × 4.4 mm) (EEWI)
RoHS / Green Yes (Pb-free, Halogen-free)
Packaging Tape-and-Reel, 2,500 units (+T)

Typical Applications

🔹 High-Resolution Data Acquisition: Programmable input gain/attenuation in 24-bit DAQ systems (e.g., AD7177, LTC2500), multi-range DMMs, and precision sensor hubs — leveraging low RON, matching, and near-zero charge injection.
🔹 Medical Imaging & Ultrasound: Beamformer channel selection, TGC path switching, and echo signal routing — enabled by high bandwidth (>200 MHz), low crosstalk (< –80 dB), and rail-to-rail signal swing.
🔹 Communications Infrastructure: RF/IF signal routing in SDR transceivers, baseband filter banks, and antenna switching modules — using excellent off-isolation and fast switching.
🔹 Automated Test Equipment (ATE): Precision signal multiplexing for calibrator outputs, DUT stimulus routing, and reference switching — benefiting from sub-0.5 Ω matching and low leakage.
🔹 Industrial Process Control: Multiplexed sensor inputs (thermocouples, RTDs, strain gauges) in PLC analog modules — supported by wide supply range (+2.7 V to +12 V) and robust ESD/latch-up immunity.
🔹 Audio & Video Routing: Professional audio mixers, broadcast video switchers, and HDMI auxiliary path switching — enabled by low distortion, high bandwidth, and low crosstalk.

Development & Design Notes

🔧 PCB Layout Best Practices:
  • Keep analog traces short and symmetrical — minimize parasitic capacitance/inductance that degrades bandwidth and increases crosstalk.
  • Use ground guard rings around analog signal paths (especially COM, NO, NC pins) — reduces coupling between adjacent channels.
  • Route digital control lines (IN0–IN3, EN) away from analog paths and add series 33 Ω resistors near the MAX3535 — dampens ringing and reduces EMI.
🔧 Power Supply Decoupling:
  • Place 100 nF X7R ceramic capacitors within 2 mm of each supply pin (VDD, VSS, GND) — critical for clean switching and stable RON.
  • For dual-supply operation: add a 10 nF capacitor between +VDD and –VSS, close to the IC — suppresses inter-rail noise.
🔧 Signal Integrity & Timing Optimization:
  • For glitch-free switching: ensure EN and INx signals are synchronized — use a common clock domain or add small RC delays if needed.
  • To reduce charge injection effects in sampling circuits: add a small (1–10 pF) capacitor from COM to GND — acts as a charge sink and improves settling.
🔧 Thermal Management & Reliability:
  • TSSOP-28 has good thermal capability (θJA ≈ 95°C/W). For continuous high-current operation (>10 mA per channel), add ≥ 100 mm² copper pour under the IC.
  • FIT rate = 22 failures per billion hours, with FMEDA report supporting IEC 61508 SIL-2 — combine periodic self-test (e.g., measure RON vs. known resistor) for functional safety.
🔧 Calibration & Accuracy Optimization:
  • For metrology-grade applications, characterize RON vs. signal voltage and temperature — enables software compensation to < 0.1 Ω effective error.
  • To minimize thermal EMFs, avoid dissimilar metals (e.g., gold-plated connectors) in the analog path and use copper-only PCB traces.
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