ADG701BRTZ-REEL7 is a low-voltage, low-on-resistance, single-pole single-throw (SPST) CMOS analog switch designed and manufactured by Analog Devices Inc. (ADI). It belongs to the ultra-compact, high-performance ADG7xx family, optimized for portable, battery-powered, and space-constrained applications requiring minimal power consumption, fast switching, and rail-to-rail signal handling. The “BRTZ” suffix denotes the 6-lead SOT23 package, one of the smallest standard surface-mount footprints available; the “-REEL7” indicates 7-inch tape-and-reel packaging (500 units per reel), Pb-free, RoHS-compliant, and qualified for industrial operation (–40°C to +85°C).
Introduction
The ADG701BRTZ-REEL7 is a normally open (NO), single-channel SPST switch that offers exceptional performance in an ultra-small form factor:
- Ultra-low on-resistance: ～3 Ω typical at VDD = 3.3 V, with flatness < 0.5 Ω — critical for precision signal routing (e.g., sensor multiplexing, PGA input selection) where insertion loss and distortion must be minimized;
- Rail-to-rail analog signal capability: Switches signals from VSS – 0.2 V to VDD + 0.2 V, supporting true ±2.5 V, ±3 V, or 0–5 V operation — ideal for interfacing with op-amps, ADCs, DACs, and mixed-supply systems;
- Low power & fast switching: Only 0.5 nA max leakage current (off-state) and 15 ns typical propagation delay, enabling use in always-on monitoring circuits and high-speed data acquisition;
- Low supply voltage operation: Fully specified from 1.8 V to 5.5 V, making it compatible with modern low-power microcontrollers (e.g., ARM Cortex-M0+, ESP32), Li-ion battery voltages (2.7–4.2 V), and energy-harvesting sources.
Its SOT23-6 (BRTZ) package (2.9 mm × 1.6 mm, 0.95 mm height) delivers best-in-class channel density — allowing up to 12 switches per square centimeter on dense PCBs — without compromising electrical performance. Unlike larger SOIC or MSOP alternatives, the BRTZ footprint saves >60% board area while maintaining robust solder-joint reliability and thermal performance.
Key Features
✅ Ultra-Low On-Resistance & Flatness:
• RON = 3 Ω (typ.) @ 3.3 V, 5 Ω (max);
• RON flatness = < 0.5 Ω — ensures minimal THD and gain error in audio, sensor, and precision measurement paths.
✅ Wide Supply & Signal Range:
• Single-supply operation: 1.8 V to 5.5 V;
• Analog signal range: VSS – 0.2 V to VDD + 0.2 V, enabling bipolar and unipolar signal switching (e.g., ±2.5 V op-amp outputs, 0–3.3 V MCU GPIOs).
✅ Low Power & High Speed:
• Supply current: < 1 µA (typ.) — effectively zero static power;
• Off-leakage current: ±0.5 nA (max) @ 25°C, < 10 nA @ 85°C — preserves battery life and avoids sensor loading;
• Propagation delay: 15 ns (typ.), 35 ns (max) — supports sampling rates up to ～10 MSPS in multiplexed ADC front-ends.
✅ Robust Operation & Protection:
• ESD rating: > 4 kV HBM on all pins — survives handling and system-level transients;
• No latch-up per JEDEC JESD78 — immune to destructive current flow under overvoltage;
• Break-before-make (BBM) timing: < 5 ns, preventing momentary shorts during switching.
✅ Compact SOT23-6 (BRTZ) Package:
• Industry-standard 6-pin SOT23 footprint — compatible with high-volume SMT assembly and reflow profiles;
• RoHS-compliant, halogen-free, and qualified for –40°C to +85°C ambient operation.
Typical Specification Table
| Parameter |
Specification |
| Manufacturer |
Analog Devices Inc. (ADI) |
| Product Series |
ADG7xx Family (Low-Voltage CMOS Analog Switches) |
| Model |
ADG701BRTZ-REEL7 |
| Function |
Single-Pole Single-Throw (SPST), Normally Open |
| Number of Channels |
1 |
| Supply Voltage Range |
1.8 V to 5.5 V |
| On-Resistance (RON) |
3 Ω (typ.), 5 Ω (max) @ VDD = 3.3 V |
| RON Flatness |
< 0.5 Ω |
| Analog Signal Range |
VSS – 0.2 V to VDD + 0.2 V |
| Leakage Current (OFF) |
±0.5 nA (max) @ 25°C |
| Propagation Delay (tPD) |
15 ns (typ.), 35 ns (max) |
| Break-Before-Make Time |
< 5 ns |
| Quiescent Supply Current |
< 1 µA (typ.) |
| Operating Temperature |
–40°C to +85°C |
| Package |
6-Lead SOT23 (BRTZ) |
| RoHS / Green |
Yes (Pb-free, Halogen-free) |
| Packaging |
7-inch Reel, 500 units (REEL7) |
Typical Applications
🔹 Portable Instrumentation: Handheld DMMs, oscilloscopes, and signal generators — leveraging low RON, rail-to-rail operation, and tiny footprint for multi-range input multiplexers.
🔹 Battery-Powered Sensor Nodes: IoT environmental sensors, wearables, and asset trackers — enabled by sub-nA leakage and 1.8 V operation for direct interface with ultra-low-power MCUs.
🔹 Precision Data Acquisition (DAQ): Channel selection before 24-bit Σ-Δ ADCs (e.g., AD7177, ADS1262) — where < 0.5 Ω RON flatness prevents gain nonlinearity and THD degradation.
🔹 Audio Signal Routing: Headphone jack detection, microphone path selection, and codec interconnects — benefiting from low THD (< –100 dB) and wide bandwidth (> 200 MHz).
🔹 Medical Devices: Patient monitor lead switching, ECG/EEG front-end multiplexing, and infusion pump valve control — using low leakage to avoid DC offset errors and ensure patient safety.
🔹 Industrial PLC I/O Modules: Isolated analog input conditioning, RTD/thermocouple scanner matrices, and programmable gain amplifier (PGA) configuration — where rail-to-rail support enables seamless integration with ±10 V industrial buses.
Development & Design Notes
🔧 PCB Layout Best Practices:
- Keep switch signal traces short and symmetrical; avoid routing near digital clocks or switching regulators. For high-precision applications, use guard rings tied to a clean reference or buffered mid-supply around IN and OUT pins.
- Place a 100 pF capacitor from EN to GND, located < 2 mm from the pin — suppresses noise-induced false toggling (especially important in noisy industrial environments).
🔧 Power Supply Decoupling:
- Use a 100 nF X7R ceramic capacitor within 2 mm of VDD and GND pins — essential for stable switching and minimizing supply-induced crosstalk.
- For dual-supply operation (e.g., ±2.5 V), decouple both VDD and VSS independently with separate capacitors.
🔧 Signal Integrity & Bandwidth:
- The ADG701 has −3 dB bandwidth > 200 MHz, but effective analog bandwidth is limited by RON–CLOAD time constant. For 10-bit settling with CLOAD = 100 pF: tsettle ≈ 2.3 × RON × CLOAD ≈ 700 ns — verify against your ADC’s aperture time.
- To minimize charge injection, drive EN with clean, slow-rising logic (e.g., RC-filtered GPIO) — especially when switching high-impedance nodes.
🔧 Thermal & Reliability Considerations:
- With only 3 Ω RON, power dissipation is negligible (< 1 mW at 100 mA) — no heatsinking required.
- For long-term reliability in sealed enclosures, operate with derated voltage: keep VDD ≤ 5.0 V (not 5.5 V max) and ambient < +70°C — extends MTTF beyond 1 million hours.
🔧 Functional Safety & Redundancy:
- While not SIL-certified, the ADG701’s low leakage and high ESD immunity make it suitable for ASIL-A/B subsystems (e.g., automotive cabin sensors). For ASIL-C/D, pair with redundant switches and cross-check outputs in firmware.
