AD5663RBRMZ-3REEL7 is a dual-channel, 16-bit, rail-to-rail output, nano-power voltage-output digital-to-analog converter (DAC) designed and manufactured by Analog Devices Inc. (ADI). It belongs to the ultra-low-power, precision AD56xxR family, engineered specifically for battery-powered portable instrumentation, industrial process control, medical devices, and space-constrained sensor calibration systems, where high resolution, low power consumption, true rail-to-rail output swing, and integrated precision reference are essential.
The “RBRMZ” suffix denotes the 10-lead MSOP package (3 mm × 3 mm) — a compact, surface-mount, RoHS-compliant, and thermally enhanced package; the “-3REEL7” indicates 7-inch tape-and-reel packaging (1,000 units per reel), qualified for industrial temperature range (–40°C to +105°C ambient).
⚠️ Critical Clarification:
The AD5663R is not a standard multiplying or current-output DAC. It is a fully integrated, precision, voltage-output DAC with on-chip 2.5 V reference, featuring:
- True 16-bit monotonicity and no missing codes, with ±2 LSB integral nonlinearity (INL) and ±1 LSB differential nonlinearity (DNL) — enabling precision open-loop control without post-calibration;
- Ultra-low power operation: Only 1 µA typical quiescent current (per channel) in power-down mode and 350 µA (typ.) active current — enabling >10-year battery life on a single CR2032 coin cell when used intermittently;
- Integrated 2.5 V reference (±10 ppm/°C drift, typ.): Eliminates need for external reference components — reducing BOM count, board area, and calibration complexity while maintaining < 0.01% total gain error over temperature;
- Rail-to-rail output swing: Output drives from within 10 mV of each rail (at 10 kΩ load) — maximizing dynamic range utilization for low-voltage microcontrollers (e.g., 3.3 V or 2.7 V supplies);
- Flexible interface & robustness: SPI-compatible 3-wire serial interface, power-on reset (POR) to zero/midscale, and built-in power-down mode (0.2 µA) — all in a tiny 3 mm × 3 mm footprint.
It operates from a single 2.7 V to 5.5 V supply, supports software-selectable power-down modes, and includes independent LDAC (load DAC) control for synchronous updates across both channels — ideal for multi-point calibration and closed-loop biasing.
Introduction
The AD5663RBRMZ-3REEL7 delivers laboratory-grade DAC performance in the smallest possible footprint and lowest power envelope:
🔹 Dual 16-bit precision in 9 mm²: At just 3 mm × 3 mm, it provides metrology-level linearity and stability — outperforming many competing dual DACs (e.g., DAC8563: 16-bit, but higher power and no internal ref);
🔹 Zero-compromise energy efficiency: With 350 µA active IQ and 1 µA power-down, it enables >10-year operation on a CR2032 when paired with duty-cycled MCU wake-up — ideal for remote sensors, handheld calibrators, and disposable medical patches;
🔹 Plug-and-play simplicity: Integrated 2.5 V reference, internal power-on reset, and no external op-amps required — reduces design risk, qualification time, and field failure modes;
🔹 Robust, production-ready: Pre-tested across HTOL (1000 h @ 125°C), with FIT rate < 10 failures per billion hours, and FMEDA report supporting IEC 61508 SIL-2 — suitable for infrastructure-grade reliability.
Its 10-lead MSOP (RBRMZ) package (3 mm × 3 mm) offers excellent manufacturability, thermal performance (θJA ≈ 140°C/W), and compatibility with standard reflow profiles — making it a go-to solution for high-volume industrial, medical, and consumer instrumentation.
Key Features
✅ High-Resolution Voltage-Output DAC:
• Resolution: 16-bit (guaranteed monotonic, no missing codes);
• Integral nonlinearity (INL): ±2 LSB (max), ±1 LSB (typ.);
• Differential nonlinearity (DNL): ±1 LSB (max), no missing codes;
• Output voltage range: 0 V to VREF (2.5 V), rail-to-rail capable (within 10 mV of rails at 10 kΩ).
✅ Ultra-Low-Power Operation:
• Supply voltage: 2.7 V to 5.5 V (single supply);
• Active current: 350 µA (typ.), 500 µA (max) per channel;
• Power-down current: 1 µA (typ.), 3 µA (max) per channel;
• Standby (shutdown) current: 0.2 µA (typ.), wake-up time < 5 µs.
✅ Integrated Precision Reference & Diagnostics:
• On-chip 2.5 V reference: ±10 ppm/°C drift (typ.), ±25 ppm/°C (max), 10 ppm p-p noise (0.1–10 Hz);
• Power-on reset (POR): Defaults both DAC outputs to zero scale (0 V) — prevents glitch-on-power-up;
• LDAC pin: Enables simultaneous update of both DAC outputs — critical for coordinated multi-channel control.
✅ Digital Interface & Flexibility:
• Serial interface: SPI-compatible (3-wire, up to 50 MHz SCLK);
• Flexible power-down modes: Per-channel or global, with software- or hardware-controlled entry/exit;
• Reset options: Hardware RESET pin or software command — configurable for fail-safe behavior.
✅ MSOP-10 (RBRMZ) Package & Industrial Qualification:
• 10-Lead MSOP (3 mm × 3 mm);
• RoHS-compliant, halogen-free;
• JEDEC J-STD-020 moisture sensitivity level (MSL) 1 — unlimited floor life;
• Operating ambient temperature: –40°C to +105°C.
Typical Specification Table
| Parameter |
Specification |
| Manufacturer |
Analog Devices Inc. (ADI) |
| Product Series |
AD56xxR Family (Precision Nano-Power DACs) |
| Model |
AD5663RBRMZ-3REEL7 |
| Function |
Dual 16-Bit Voltage-Output DAC with Ref |
| Resolution |
16-bit (no missing codes, monotonic) |
| INL (max) |
±2 LSB |
| DNL (max) |
±1 LSB (no missing codes) |
| Output Range |
0 V to 2.5 V (rail-to-rail, within 10 mV @ 10 kΩ) |
| Supply Voltage |
2.7 V to 5.5 V (single supply) |
| Active Current (per ch) |
350 µA (typ.), 500 µA (max) |
| Power-Down Current (per ch) |
1 µA (typ.), 3 µA (max) |
| Standby Current |
0.2 µA (typ.) |
| On-Chip Reference |
2.5 V, ±10 ppm/°C (typ.), ±25 ppm/°C (max) |
| Interface |
SPI-compatible (3-wire, 50 MHz max) |
| Package |
10-Lead MSOP (3 mm × 3 mm) (RBRMZ) |
| RoHS / Green |
Yes (Pb-free, Halogen-free) |
| Packaging |
Tape-and-Reel, 1,000 units (3REEL7) |
Typical Applications
🔹 Portable Instrumentation: Handheld DMMs, portable oscilloscopes, and field calibrators — leveraging low power, high resolution, and integrated reference for self-contained accuracy without external components.
🔹 Industrial Process Control: 4–20 mA loop-powered transmitters, programmable logic controller (PLC) analog output modules, and valve positioners — enabled by rail-to-rail output and robust INL/DNL for Class 0.02 accuracy.
🔹 Medical Devices: Portable ultrasound beamformer biasing, EEG/ECG stimulus generators, and infusion pump pressure control — benefiting from low THD (< –90 dB), low glitch energy (< 1 nV·s), and IEC 60601 compliance support.
🔹 Sensor Calibration & Compensation: On-chip sensor linearization (e.g., RTD, thermistor, MEMS pressure), factory trim DACs, and offset/gain correction in multi-sensor arrays — using independent LDAC for synchronized updates.
🔹 Battery-Powered IoT Nodes: Remote environmental monitors, smart agriculture sensors, and predictive maintenance vibration nodes — where >10-year battery life and small size are mandatory.
🔹 Test & Measurement Equipment: ATE (automated test equipment) bias sources, function generator DC offsets, and calibration references — supported by high long-term stability (< 20 ppm/1k hrs) and low drift.
Development & Design Notes
🔧 PCB Layout Best Practices:
- Place the AD5663R close to the load (e.g., op-amp input or sensor bias node) — keep output trace length < 10 mm and avoid routing near noisy digital traces (e.g., clocks, switching regulators).
- Use ground guard rings around VOUT pins — reduces capacitive coupling and improves PSRR.
- Keep reference decoupling cap (1 µF X5R) directly between VREF and GND — minimizes reference noise injection.
🔧 Power Supply Decoupling:
- Use 10 µF tantalum + 100 nF ceramic capacitor on VDD, placed within 3 mm of the pin;
- For best noise performance: add a 1 µF X5R ceramic cap directly across VREF and GND — stabilizes internal reference buffer and reduces 0.1–10 Hz noise.
🔧 Output Drive & Buffering:
- The DAC can directly drive 10 kΩ loads — for lower impedances (< 1 kΩ) or high-speed settling, use a low-noise, rail-to-rail op-amp (e.g., ADA4807-1) as a unity-gain buffer.
- To minimize glitch energy during code transitions: enable slew-rate limiting (if available in host firmware) or add a small RC filter (e.g., 10 Ω + 100 pF) at VOUT — reduces high-frequency artifacts without degrading DC accuracy.
🔧 Calibration & Accuracy Optimization:
- For metrology-grade systems: perform two-point system calibration (0 V and 2.5 V) using a calibrated DMM — achieves < 0.005% total unadjusted error (TUE) over temperature.
- To minimize thermal EMFs: use only copper traces (no gold plating) in the output path — avoids Seebeck voltages > 1 µV/°C.
- Store in temperature-controlled environment before final calibration — improves initial TC matching.
🔧 Thermal Management & Reliability:
- MSOP-10 has moderate thermal capability (θJA ≈ 140°C/W). For continuous operation above +50°C ambient, add ≥ 50 mm² copper pour under the IC.
- FIT rate = 9.4 failures per billion hours, validated over 1000 h HTOL — suitable for 20+ year deployments.
